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  • 300 MM Wafer Laser Anneal Process Development for Applications of . . .
    With technology developing, laser annealing is attracting more and more interests because of its property of lower thermal budget, near surface activation for shallow junction application, rapidly cooling rate, etc In this work, the wafer after implantation process was divided into different zones, and process was developed to implement different laser annealing condition in different zones
  • Improving the crystal quality of AlN films by nanosecond laser annealing
    In this experiment, the high-power laser annealing equipment developed by Institute of Semiconductors, Chinese Academy of Sciences was used The laser light source wavelength was 532 nm with a maximum laser energy of 5 J and a maximum power density of 80 kW⸱cm −2 @0 2mm × 0 2 mm, which was shaped into a square flat-top spot of 0 4 mm × 0 4 mm
  • Laser spike annealing resolves sub-20nm logic device manufacturing . . .
    By YUN WANG, Ph D , Ultratech, San Jose, CA Sub-20nm system-on-chip and FinFET devices have specific manufacturing challenges that can be resolved with laser spike annealing (LSA) technology Over the last decade, new process technologies and materials have emerged, such as strained silicon, high-k metal gate (HKMG) and advanced silicide
  • Recent Progresses and Perspectives of UV Laser Annealing . . . - MDPI
    The state-of-the-art CMOS technology has started to adopt three-dimensional (3D) integration approaches, enabling continuous chip density increment and performance improvement, while alleviating difficulties encountered in traditional planar scaling This new device architecture, in addition to the efforts required for extracting the best material properties, imposes a challenge of reducing
  • Emerging Opportunities in Semiconductor Laser Annealing Market
    The semiconductor laser annealing market, valued at $900 million in 2025, is projected to experience robust growth, driven by the increasing demand for advanced semiconductor devices in various applications The compound annual growth rate (CAGR) of 8 1% from 2025 to 2033 indicates a significant expansion, fueled primarily by the rising adoption of power semiconductor devices in electric
  • Understand Laser Processes: Annealing, Etching, Engraving
    Laser Annealing Process: An Overview Laser annealing is a non-contact laser marking technique used to create permanent colored marks on a substrate During the process, a de-focused infrared laser is applied to the material, raising carbon to the surface The laser slowly heats up the material’s internal molecules, causing them to oxidize
  • 7 Types of Annealing Explained | MachineMFG
    Laser Annealing, Traditional Oven Annealing, etc These are more modern or specific application annealing methods used to reduce hardness, improve machinability, eliminate residual stresses, stabilize dimensions, reduce deformation and cracking tendencies, refine grains, adjust structure, and eliminate structural defects
  • Modeling of laser annealing | Journal of Computational Electronics
    Processes inducing micro- and nano-structural modifications of materials play a crucial role in the advanced technology In particular, laser irradiation attracts a great interest as a tool for the localized thermal treatment (laser thermal annealing) when the global heating of the sample could be detrimental With the expansion of the application fields, a research effort is required to
  • High-performance of laser annealed ITO Cr-Ag ITO . . . - ScienceDirect
    A novel laser annealing treatment was used to enhance the optoelectronics, and the morphological properties of ITO Cr-Ag ITO (ICAI) thin film are presented The multilayer thin film was deposited using the RF magnetron sputtering technique and annealed using an Nd:Yag laser The ICAI properties were characterized using X-ray diffraction, an atomic force microscope, field emission scanning
  • Laser Annealing | KEYENCE India
    Using the laser annealing process for marking also requires no extra materials like ink or labelling paper The laser annealing machine creates logos, barcodes, serial numbers, and 2D codes from the material itself Fibre lasers are the most common laser used as a laser annealing machine These lasers use a 1090 nm wavelength produced by
  • Multiscale atomistic modelling of ultrafast melting in laser annealing . . .
    Ultraviolet Nanosecond Laser Annealing (LA) is a powerful tool for both fundamental investigations of ultrafast, nonequilibrium phase-change phenomena and technological applications (e g , the
  • Method of laser annealing process - Google Patents
    the method of laser annealing process comprising: generating a Laser Beam ( 0 ) by a Laser Source ( 2 ); reflecting and converging the laser beam; scanning Amorphous Silicon ( 11 ) on the surface of a Substrate ( 1 ) at a predetermined speed by Laser Beam ( 0 ); wherein, the Laser Beam ( 0 ) is generated in pulse train; the pulse train includes M groups of pulse train, where the each train
  • Simulation of the sub-melt laser anneal process in 45 CMOS technology . . .
    Due to the continuous CMOS transistor scaling requirements, sub-melt millisecond laser annealing has been introduced in 45 nm CMOS technology to enhance dopant activation without any additional diffusion Because of the design, the device layout at the wafer surface introduces during this process significant variations of optical absorption and heat transfer that can induce temperature non
  • Thin-Wafer Silicon IGBT With Advanced Laser Annealing and Sintering Process
    A novel insulated gate bipolar transistor (IGBT) featuring thin-wafer processing and a combined dopant activation laser annealing and contact metal laser sintering is presented The device concept includes a new back-side boron anode (collector) activation process by laser annealing through a titanium layer to enhance the absorption of the deposited energy from the laser beam This technology
  • Laser annealing applications for semiconductor devices manufacturing
    (DOI: 10 1016 B978-0-12-820255-5 00008-8) In the history of semiconductor device fabrication, annealing is one of the critical process steps used to achieve the targeted device performance Thermal budget requirements in most semiconductor manufacturing process steps have always followed a downward trend through either a reduction of the time spent at high temperature or a lowering of the peak





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