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  • Submicron Die Bonders - mycronic. com
    Designed for integrated photonics volume manufacturing applications, semiconductor wafer level packaging, multi-chips, multi-processes production in one machine Two Modes with auto-change over: ±0 5μm @ 3σ and ±1 5μm @ 3σ; both with on-axis z-force for die bonding
  • FINEPLACER® sigma - SW Systems
    The FINEPLACER ® sigma combines sub-micron placement accuracy with a 450 x 150 mm working area and bonding forces up to 1000 N The system is ideal for all types of precision die bonding and flip chip applications at chip and wafer level
  • Semiconductor Chip Bonding Report: How Sub-Micron Die Bonders are . . .
    The semiconductor chip bonding report analyzes emerging technologies, innovative solutions in the area of sub-micron die bonders The chip bonding report also sheds light on key players, startups and market trends
  • AMICRA NANO | ASMPT SEMI Solutions
    ASMPT AMICRA's fully automatic, die bonder flip chip bonder with exceptionally high precision and placement accuracy (±1 5 µm), a cycle time of <15 sec as well as a modular machine concept, a flip chip option and much more
  • West Bond - Semiconductor Wire Bonding Machines, Tools, Services.
    Since 1966, WEST•BOND has designed and manufactured a renowned line of wire bonding and die attach machines, wire pull and shear test equipment, ultrasonic components, and accessories for the microelectronics packaging industry
  • Die Bonding. Epoxy Die Bonding. Eutectic Die Bonding - CWI Technical Sales
    The T-6000-L Die Bonder is a fully-automated all-purpose system for medium sized-, pilot- and R D production Equipped with linear motors and 0 1 µm resolution glass scales, this enables a movement precision of 8 µm @ 3Sigma
  • Die Sorter, Die Bonder, Die Attach Semiconductor Solutions
    As sub BU of HJS group, this company’s main business is high-precision die bonder, die sorter and related customized equipment in the optical communication and semiconductor industry Our equipment includs but not limited to:
  • DB258H High-Accuracy Bonder for Optical Communication and Optical . . .
    Low-cost high-accuracy bonder Accuracy: ±2µm DB258H (Thermo-compression (TC) bonding system) This high-accuracy thermo-compression (TC) bonder is suitable for laser diode bonding, sub-mount bonding and optical device bonding under optical module assembly


















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