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  • Boschman | Advanced Packaging Technology
    Boschman is a high-tech, solution driven Dutch company focusing on advanced packaging solutions We provide a unique one-stop-shop concept – from idea to industrialization – offering our customers one point of contact for all packaging business
  • Advanced Packaging Technology - Boschman
    Boschman 是一家以解决方案为导向的荷兰高科技公司,专注于提供先进的封装解决方案。 我们秉持独特的一站式服务理念,从构想到工业化,针对所有封装业务为客户提供一站式接洽点。
  • Our technologies – Ag sintering (rood) - Boschman
    Boschman offers two categories of silver (Ag) sintering solutions: for R D, prototyping and low volume production we offer the Semi-automatic Sinterstar Innovate series And for efficient, high quality medium to high volume production the Sinterstar Auto and Inline series are the best choice
  • About us - Boschman
    Boschman Advanced Packaging Technology is a family owned company, founded in 1987 and headed by Frank and Eef Boschman Frank is Co-founder and CEO of the Boschman Advanced Packaging Technology group and Managing Director of Boschman Equipment
  • Equipment - Boschman
    Boschman specializes in the development and supply of advanced transfer molding and sintering systems for electronic assembly industries across the globe We offer added-value encapsulation and bonding process and equipment solutions for a wide range of packages
  • Contact - Boschman
    Boschman (NL) Advanced packaging technology Stenograaf 3, 6921 EX Duiven The Netherlands T +31 26 319 4900
  • About us - Boschman
    Boschman Technologies 成立于 1987 年,是一家以 Frank 和 Eef Boschman 为掌门人的家族企业。 Frank 是 Boschman Advanced Packaging Technology 的联合创始人兼首席执行官,也是 Boschman Equipment 的总经理。
  • Ag-Sintering technology - Boschman
    Boschman 提供两种银烧结解决方案:对于研发、原型制作和小批量生产,我们提供半自动 Sinterstar Innovate 系列。 而对于高效、高质量的中到大批量生产,Sinterstar Auto 和 Inline 系列是最佳选择。
  • Our technologies – Dynamic Insert Technology(rood) - Boschman
    Boschman offers two categories of Ag sintering and Film Assisted Molding (FAM) solutions: for R D, prototyping and low volume production we offer the Semi-automatic, Sinter- en Unistar Innovate series
  • Package development - Boschman
    Boschman (SG) Advanced packaging technology No 3 Kaki Bukit Crescent, #01-01, Singapore 416237 T +65 6743 7188





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